IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR 28-HZL/01-7-TT

AR 28-HZL/01-7-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 28-HZL/01-7-TT

Datasheet

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-ICS-254-20-TT50

A-ICS-254-20-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0
RFQ
A-ICS-254-20-TT50

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 42-HZL/07-TT

AR 42-HZL/07-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 42-HZL/07-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 24-HZW/TN

AR 24-HZW/TN

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0
RFQ
AR 24-HZW/TN

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 48-HZL/07-TT

AR 48-HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0
RFQ
AR 48-HZL/07-TT

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-ICS-254-24-TT50

A-ICS-254-24-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0
RFQ
A-ICS-254-24-TT50

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 50-HZL/07-TT

AR 50-HZL/07-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 50-HZL/07-TT

Datasheet

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 52-HZL/07-TT

AR 52-HZL/07-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 52-HZL/07-TT

Datasheet

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-ICS-254-28-TT50

A-ICS-254-28-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0
RFQ
A-ICS-254-28-TT50

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR32-HZW/T-R

AR32-HZW/T-R

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components

0
RFQ
AR32-HZW/T-R

Datasheet

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
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