Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 3 - Original source of goods

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
AR 14-HZL/01-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	9,397	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR 06-HZL/07-TT CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	3,552	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR 18-HZL-TT CONN IC DIP SOCKET 18POS TIN Assmann WSW Components	652	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR 14-HZL-TT CONN IC DIP SOCKET 14POS TIN Assmann WSW Components	372	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AW 127-20/G-T SOCKET, MACHINED CONTACTS, SGL. Assmann WSW Components	828	-	RFQ	Datasheet	-	Bag	Active	-	-	0.100" (2.54mm)	Gold	Flash	-	Through Hole	-	Solder	-	Gold	Flash	-	-	-40°C ~ 105°C
A-CCS 044-Z-SM IC SOCKET PLCC 44POS TIN SMD Assmann WSW Components	4,820	-	RFQ	Datasheet	-	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
A-CCS 032-Z-T CONN SOCKET PLCC 32POS TIN Assmann WSW Components	2,533	-	RFQ	Datasheet	-	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
A-CCS 028-Z-T CONN SOCKET PLCC 28POS TIN Assmann WSW Components	764	-	RFQ	Datasheet	-	Tube	Active	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
AR 16-HZL/01-TT CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	5,069	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS 052-Z-T IC SOCKET PLCC 52POS TIN Assmann WSW Components	1,119	-	RFQ	Datasheet	-	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C

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