IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































ASSMANN WSW Components
全部重置
应用所有
结果: 326
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR 10-HZW/TN

AR 10-HZW/TN

CONN IC DIP SOCKET 4POS TIN

Assmann WSW Components

0
RFQ
AR 10-HZW/TN

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 50-HZL-TT

AR 50-HZL-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 50-HZL-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS 032-Z-SM/T

A-CCS 032-Z-SM/T

IC SOCKET, CHIP CARRIER, 1.27MM,

Assmann WSW Components

0
RFQ
A-CCS 032-Z-SM/T

Datasheet

- Tape & Reel (TR) Active PLCC 32 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AR 36-HGL-TT

AR 36-HGL-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 36-HGL-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 52-HZL-TT

AR 52-HZL-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 52-HZL-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0
RFQ
A40-LCG

Datasheet

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
AW 127-39/Z-T

AW 127-39/Z-T

SOCKET 39 CONTACTS SINGLE ROW

Assmann WSW Components

0
RFQ
AW 127-39/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
AR 18-HZL/01-TT

AR 18-HZL/01-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0
RFQ
AR 18-HZL/01-TT

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A20-LCG-T-R

A20-LCG-T-R

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0
RFQ
A20-LCG-T-R

Datasheet

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-CCS32-Z-R

A-CCS32-Z-R

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0
RFQ
A-CCS32-Z-R

Datasheet

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
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