Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 83 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
02-7350-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7400-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7420-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7425-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7450-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7520-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7540-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7625-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7920-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
32-0518-10T CONN SOCKET SIP 32POS GOLD Aries Electronics	-	RFQ	Datasheet	518	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-

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