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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-8770-310C

24-8770-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-8770-310C

Datasheet

 		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-8844-310C

24-8844-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-8844-310C

Datasheet

 		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-8900-310C

24-8900-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-8900-310C

Datasheet

 		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-3571-10

28-3571-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-3571-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-3572-10

28-3572-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-3572-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-3573-10

28-3573-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-3573-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-3574-10

28-3574-10

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

 0
RFQ
28-3574-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6571-10

28-6571-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-6571-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6572-10

28-6572-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-6572-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6573-10

28-6573-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-6573-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
Total 4131 Record«Prev1... 253254255256257258259260...414Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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