IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-87-422-41-006101

116-87-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
116-87-422-41-006101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-084-24-000000

540-99-084-24-000000

CONN SOCKET PLCC 84POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-084-24-000000

Datasheet

540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
HLS-0104-T-31

HLS-0104-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-T-31

Datasheet

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-87-632-41-001151

110-87-632-41-001151

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
C8140-04

C8140-04

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

0
RFQ
C8140-04

Datasheet

Edge-Grip™, C81 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0513-10T

17-0513-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0
RFQ
17-0513-10T

Datasheet

0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-1518-10T

20-1518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-1518-10

22-1518-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0
RFQ
22-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0513-11H

06-0513-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0513-11H

Datasheet

0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0508-30

04-0508-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0
RFQ
04-0508-30

Datasheet

508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
04-1508-30

04-1508-30

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0
RFQ
04-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
540-44-028-24-000000

540-44-028-24-000000

CONN SOCKET PLCC 28POS TIN

Mill-Max Manufacturing Corp.

0
RFQ
540-44-028-24-000000

Datasheet

540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
SIP1X32-041B

SIP1X32-041B

SIP1X32-041B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0
RFQ
SIP1X32-041B

Datasheet

SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
110-87-328-41-105101

110-87-328-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
110-87-328-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
4-382568-8

4-382568-8

CONN IC DIP SOCKET 48POS TIN

TE Connectivity AMP Connectors

0
RFQ
4-382568-8

Datasheet

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
614-87-428-41-001101

614-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
614-87-428-41-001101

Datasheet

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1-1825108-1

1-1825108-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0
RFQ

-

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
116-87-316-41-002101

116-87-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
116-87-316-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-636-41-001101

110-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0
RFQ
110-87-636-41-001101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-424-31-012101

614-87-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
614-87-424-31-012101

Datasheet

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 157158159160161162163164...955Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

ABOUT

ABOUT