IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR 42-HZL/01-TT

AR 42-HZL/01-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-87-316-41-008101

116-87-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
116-87-316-41-008101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-6518-10T

28-6518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6518-10T

Datasheet

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
5-1437529-9

5-1437529-9

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors

0
RFQ

-

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
SIP050-1X25-157B

SIP050-1X25-157B

1X25-157B-SIP SOCKET 25 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X25-157B

Datasheet

SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
122-87-318-41-001101

122-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
122-87-318-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-318-41-001101

123-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
123-87-318-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0103-G-12

HLS-0103-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0103-G-12

Datasheet

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
612-87-624-41-001101

612-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
612-87-624-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-001101

116-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
116-87-314-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0518-11H

08-0518-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0
RFQ
08-0518-11H

Datasheet

518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-1518-11H

08-1518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
08-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-1518-11

14-1518-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-1518-11

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
17-0518-10H

17-0518-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0
RFQ
17-0518-10H

Datasheet

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-83-318-41-105101

110-83-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
110-83-318-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HZL/07-TT

AR 22-HZL/07-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICO-308-STT-L

ICO-308-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-308-STT-L

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-310-41-011101

116-83-310-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-83-310-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-322-41-003101

116-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
116-87-322-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-314-41-001101

122-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
122-83-314-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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