IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-87-316-41-105161

110-87-316-41-105161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
110-87-316-41-105161

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0513-10T

08-0513-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0
RFQ
08-0513-10T

Datasheet

0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A-CCS28-G

A-CCS28-G

CONN SOCKET PLCC 28POS GOLD

Assmann WSW Components

0
RFQ
A-CCS28-G

Datasheet

- Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
116-87-316-41-006101

116-87-316-41-006101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
116-87-316-41-006101

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-306-41-011101

116-83-306-41-011101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0
RFQ
116-83-306-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-312-41-001101

614-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
614-83-312-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-314-41-003101

115-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
115-83-314-41-003101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-308-41-035101

146-83-308-41-035101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0
RFQ
146-83-308-41-035101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
643652-3

643652-3

CONN SOCKET SIP 20POS TIN

TE Connectivity AMP Connectors

0
RFQ
643652-3

Datasheet

Diplomate DL Tray Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
A-CCS068-Z-SM/T

A-CCS068-Z-SM/T

SOCKET

Assmann WSW Components

0
RFQ
A-CCS068-Z-SM/T

Datasheet

- Bulk Active PLCC 68 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AJ 64-LC

AJ 64-LC

SOCKET

Assmann WSW Components

0
RFQ

-

- Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
114-87-306-41-134191

114-87-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0
RFQ
114-87-306-41-134191

Datasheet

114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PRT-07942

PRT-07942

DIP SOCKETS SOLDER TAIL - 28-PIN

SparkFun Electronics

0
RFQ

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - - Through Hole Open Frame Solder - - - - - -
123-87-312-41-001101

123-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
123-87-312-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-044-24-000000

540-99-044-24-000000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-044-24-000000

Datasheet

540 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
1571539-1

1571539-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors

0
RFQ
1571539-1

Datasheet

- Bulk Obsolete PLCC 20 (4 x 5) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 125°C
110-87-328-41-001101

110-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
110-87-328-41-001101

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-TT-2

HLS-0204-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0204-TT-2

Datasheet

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
09-0513-10

09-0513-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0
RFQ
09-0513-10

Datasheet

0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-0513-10T

10-0513-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0
RFQ
10-0513-10T

Datasheet

0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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