IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-83-210-01-839101

110-83-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
110-83-210-01-839101

Datasheet

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-308-41-001101

122-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0
RFQ
122-83-308-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-320-41-001101

115-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR40-HZL/01-TT

AR40-HZL/01-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0
RFQ
AR40-HZL/01-TT

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-87-310-41-007101

116-87-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-87-310-41-007101

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-20LCC-N

SMPX-20LCC-N

SMT PLCC SOCKET 20P NON POLARISE

Kycon, Inc.

0
RFQ
SMPX-20LCC-N

Datasheet

SMPX Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
110-83-210-41-105101

110-83-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
110-83-210-41-105101

Datasheet

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-610-41-001101

612-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
612-83-610-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-210-41-006101

116-83-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-83-210-41-006101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-006101

116-83-310-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-83-310-41-006101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR24-HZL/01-TT

AR24-HZL/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0
RFQ
AR24-HZL/01-TT

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
10-0518-10T

10-0518-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0
RFQ
10-0518-10T

Datasheet

518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-1518-10T

10-1518-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-382467-1

2-382467-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0
RFQ
2-382467-1

Datasheet

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-001B

SIP1X20-001B

SIP1X20-001B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

0
RFQ
SIP1X20-001B

Datasheet

SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
540-88-068-17-400

540-88-068-17-400

CONN SOCKET PLCC 68POS TIN

Preci-Dip

0
RFQ
540-88-068-17-400

Datasheet

540 Bulk Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
115-87-420-41-001101

115-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-10-002101

110-83-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
110-83-314-10-002101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 28 HGL-TT

AR 28 HGL-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 28 HGL/7-TT

AR 28 HGL/7-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
Total 19086 Record«Prev1... 116117118119120121122123...955Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

ABOUT

ABOUT